Akasa Pi-5 Pro - Aluminum Raspberry Pi 5 Enclosure

An industrial-style aluminium enclosure that acts as a heatsink to prevent thermal throttling on the Raspberry Pi 5.


Description

The Akasa Pi-5 Pro is a fanless aluminium case designed for Raspberry Pi systems, providing passive thermal management in a fully enclosed form factor. The chassis is constructed from solid aluminium and functions as a heatsink, drawing heat away from the processor through integrated thermal pads. This design enables silent operation while improving thermal stability under sustained workloads, making it a practical alternative to active cooling solutions.

Reliable Heat Dissipation

Compared to standard plastic enclosures or small heatsinks, the Pi-5 Pro offers significantly greater heat dissipation by utilising the entire enclosure as a thermal mass. This allows the Raspberry Pi to maintain more consistent performance during continuous operation.

  • A higher thermal mass reduces the likelihood of thermal throttling in compute-heavy applications.
  • The fanless design completely eliminates moving parts, increasing reliability in environments where dust, vibration, or long service life are concerns.
  • The enclosure maintains full access to the Raspberry Pi’s primary I/O while protecting the board within a compact, industrial-style housing.

Built for 24/7 Deployment

This enclosure is well-suited for embedded systems, industrial control, home automation, and edge deployments where silent operation and dependable thermal performance are required. By combining mechanical protection with passive cooling, the Pi-5 Pro stands out as a straightforward solution for deploying Raspberry Pi systems in long-term or noise-sensitive applications.

Combining this Pi-5 Pro Enclosure with the VESA Mounting Cover enables behind-display installation, significantly reducing the overall system footprint and improving cable management.


Specifications

  • Fanless aluminium enclosure
  • Passive heatsink design
  • Integrated thermal pad heat transfer
  • Silent operation (no moving parts)
  • Improved thermal performance vs. standard cases
  • Reduced thermal throttling under load
  • Full enclosure for board protection
  • Access to Raspberry Pi I/O headers and connectors
  • Compact industrial form factor
  • Increased reliability for 24/7 operation
  • No active cooling required
  • Designed for Raspberry Pi systems

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